Beijing Microelectronics Technology Institute (BMTI), founded in 1994, is an important unit of China Academy of Aerospace Electronics Technology affiliated with China Aerospace
BMTI has successfully established product family including SoC, FPGA, memory, ADC/DAC, bus and interface, logic, power management, RF and MMIC, ASIC and discrete devices.
The packaging center of BMTI is composed of a wire-bond packaging line, a flip-chip packaging line and a discrete device packaging line. The center is mainly responsible for the
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